TW stock · Technology sector · Semiconductors
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ASE Technology Holding Co., Ltd.

ASXNYSE

4.99

USD
-0.02
(-0.40%)
Market Closed
6.00P/E
6Forward P/E
0.30P/E to S&P500
10.751BMarket CAP
139.72%Div Yield
Upcoming Earnings
- -
Shares Short
8/31/22
8.44M
Short % of Float
- -
Short % of Shares Outs.
0.39%
% Held by Insiders
- -
% Held by Institutions
6.69%
Beta
1.30
PEG Ratio
0.19
52w. high/low
8.15/4.88
Avg. Daily Volume
6.80M
Return %
Stock
S&P 500
1 year
(36.82)
(16.20)
3 years
11.83
22.35
5 years
(18.54)
44.82
Scale: |
High
Low
6.34
4.42
5.56
1.36
4.63
1.49
5.97
3.33
6.66
4.00
5.40
3.44
5.38
3.87
6.89
4.44
8.12
4.54
6.23
4.39
7.52
5.04
8.00
3.51
5.70
3.46
5.94
3.17
9.62
5.92
8.15
4.88
Currency:
2006
2007
2008
2009
2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
TTM
Revenue per share
55.18
61.00
49.52
47.68
100.43
97.14
104.31
117.11
133.55
148.11
143.45
142.52
174.81
194.21
223.68
264.79
292.65
Earnings per share
9.57
7.34
3.78
3.75
9.76
7.19
7.04
8.21
11.57
10.46
11.15
11.20
12.35
8.02
12.65
27.94
34.46
FCF per share
10.63
6.30
6.32
2.26
1.40
0.71
(6.01)
6.31
3.05
14.00
12.98
10.99
4.29
6.48
5.57
4.09
8.79
Dividends per share
- -
4.19
4.63
1.43
1.03
2.02
2.28
4.17
5.19
8.00
6.39
5.50
5.00
4.99
4.00
8.40
8.42
CAPEX per share
9.86
10.77
9.80
6.36
18.27
16.03
21.62
15.69
20.82
16.09
14.21
12.29
19.77
27.50
29.63
33.88
33.19
Book Value per sh.
36.28
45.33
36.53
39.81
47.12
53.02
58.89
64.78
76.76
80.89
80.82
92.31
94.87
93.74
101.35
117.82
116.45
Comm.Shares outs.
1,820
1,658
1,907
1,799
1,879
1,908
1,860
1,877
1,921
1,913
1,916
2,038
2,123
2,128
2,132
2,153
2,147
Avg. annual P/E ratio
0.4
0.7
1.0
0.8
0.4
0.7
0.6
0.5
0.5
0.6
0.5
0.6
0.4
0.5
0.4
0.3
6.0
P/E to S&P500
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.3
Avg. annual div. yield
- -
81.0%
124.1%
45.6%
23.6%
38.4%
52.4%
95.3%
88.7%
127.8%
115.3%
88.2%
93.3%
113.2%
87.4%
106.9%
126.4%
Revenue (m)
100,408
101,168
94,431
85,775
188,743
185,347
193,972
219,862
256,591
283,303
274,884
290,441
371,092
413,182
476,979
569,997
628,431
Operating margin
20.4%
19.1%
12.5%
10.5%
12.8%
9.1%
9.2%
9.4%
11.6%
8.7%
9.4%
8.7%
7.3%
5.6%
7.4%
11.1%
11.9%
Depreciation (m)
14,486
16,627
17,245
17,638
19,854
22,945
23,414
25,471
26,351
29,519
29,422
29,205
42,689
50,467
51,259
54,524
55,186
Net profit (m)
17,413
12,166
7,207
6,745
18,338
13,726
13,091
15,405
22,229
20,014
21,362
22,819
26,221
17,061
26,971
60,150
73,987
Income tax rate
9.4%
19.3%
23.9%
17.7%
15.9%
17.8%
18.3%
18.1%
19.9%
17.0%
19.2%
21.0%
14.1%
21.5%
19.9%
22.4%
18.9%
Net profit margin
17.3%
12.0%
7.6%
7.9%
9.7%
7.4%
6.7%
7.0%
8.7%
7.1%
7.8%
7.9%
7.1%
4.1%
5.7%
10.6%
11.5%
Working capital (m)
20,749
21,152
21,096
26,839
25,864
23,370
13,339
30,117
46,275
34,037
35,820
36,562
42,927
47,701
49,421
75,112
48,536
Long-term debt (m)
29,394
23,937
51,230
49,080
52,375
50,167
44,592
50,163
55,375
66,234
73,890
44,127
144,105
177,414
156,614
166,120
138,290
Equity (m)
66,010
75,177
69,672
71,616
88,556
101,170
109,515
121,616
147,482
154,714
154,878
188,120
201,388
199,427
216,115
253,627
263,039
ROIC
18.0%
12.3%
6.9%
6.4%
13.5%
9.7%
9.3%
9.6%
11.4%
9.5%
9.8%
10.1%
8.2%
5.3%
7.6%
14.2%
17.7%
Return on capital
15.5%
11.3%
7.5%
6.1%
11.4%
8.3%
7.4%
7.5%
9.3%
7.5%
8.4%
8.9%
6.6%
4.8%
6.6%
12.3%
13.4%
Return on equity
26.4%
16.2%
10.3%
9.4%
20.7%
13.6%
12.0%
12.7%
15.1%
12.9%
13.8%
12.1%
13.0%
8.6%
12.5%
23.7%
28.1%
Plowback ratio
100.0%
42.9%
(22.5)%
61.8%
89.4%
71.9%
67.6%
49.1%
55.2%
23.6%
42.7%
50.9%
59.5%
37.7%
68.4%
69.9%
75.6%
Div.&Repurch./FCF
(4.4)%
56.7%
82.4%
95.6%
119.1%
487.6%
(37.9)%
37.5%
169.9%
77.0%
49.2%
4.1%
117.3%
77.0%
71.7%
268.2%
95.8%
Forex (TWD/USD)
0.031
0.031
0.030
0.031
0.034
0.033
0.034
0.034
0.032
0.030
0.031
0.034
0.033
0.033
0.036
0.036
0.034
Capital Structure
30 Jun · 2022 | Q2
All numbers in millions
Total liabilities
$ 434,768
Total assets
$ 713,079
Long-term debt
$ 138,290
Cash and equiv.
$ 72,846
Goodwill
$ - -
Retained earnings
$ - -
Common stock
2,144
Enterprise Value
$ 76,195
Working Capital
Currency: USD, in millions
2019
2020
2021
Cash & Investments
65,024
56,432
79,148
Receivables
86,693
101,014
135,344
Inventory
45,300
61,988
73,245
Other
4,984
(4,014)
20,563
Current assets
202,001
224,013
292,358
Acc. Payable
56,066
73,268
84,470
Debt due
43,335
41,315
49,558
Other
54,900
60,009
83,217
Current liabilities
154,300
174,592
217,245
Annual growth rates
(avg. rate of change)
1 year
5 years
10 years
Revenue
19.50%
18.51%
13.02%
Cash flow
(25.92)%
(11.92)%
3.91%
Earnings
123.02%
40.27%
25.18%
Dividends
112.21%
21.79%
24.91%
Book value
17.36%
7.95%
10.07%
Quarterly Revenue
Currency: USD, in millions
Year
1Q
2Q
3Q
4Q
Total
2020
97,357
107,549
123,195
148,877
476,978
2021
119,470
126,926
150,665
172,936
569,997
2022
144,391
160,439
- -
- -
- -
Earnings per share
Currency: USD
Year
1Q
2Q
3Q
4Q
Total
2020
1.83
3.25
3.15
4.71
12.94
2021
3.98
4.80
6.59
14.36
29.73
2022
6.02
7.46
- -
- -
- -
Quarterly dividends paid
Currency: USD
Year
1Q
2Q
3Q
4Q
Total
2020
- -
- -
4.00
- -
4.00
2021
- -
- -
8.40
- -
8.40
2022
- -
- -
- -
- -
- -
Company Description
Sector:
Technology
Industry:
Semiconductors
CEO:
Mr. C. S. Chang
Full-time employees:
97,800
City:
Kaohsiung
Address:
26 Chin Third Road
IPO:
Aug 28, 2001
Website:
ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various packages; and copper and silver wire bonding solutions. The company also provides advanced packages, such as flip chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer-level packaging; SESUB; and 2.5D silicon interposer. In addition, it offers IC wire bonding packages; system-in-package products (SiP) and modules; and interconnect materials, as well as assembles automotive electronic products. Further, the company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/MEMS/discrete final testing, and other test-related services, as well as drop shipment services. Additionally, it develops, constructs, sells, leases, and manages real estate properties; produces substrates; offers information software, equipment leasing, investment advisory, and warehousing management services; processes and sells computer and communication peripherals, electronic components, telecommunications equipment, and motherboards; and imports and exports goods and technology. The company was incorporated in 1984 and is headquartered in Kaohsiung, Taiwan.