TW stock · Technology sector · Semiconductors
A
ASE Technology Holding Co., Ltd.
ASX
NYSE7.88
USD
+0.32
(+4.23%)
Market Closed
8.58P/E
9Forward P/E
0.41P/E to S&P500
16.944BMarket CAP
116.40%Div Yield
Upcoming Earnings
- -
Shares Short
5/15/23
5.19M
Short % of Float
- -
Short % of Shares Outs.
0.24%
% Held by Insiders
- -
% Held by Institutions
7.62%
Beta
1.17
PEG Ratio
-3.14
52w. high/low
7.97/4.45
Avg. Daily Volume
5.93M
Return %
Stock
S&P 500
1 year
3.51
(9.05)
3 years
81.53
50.26
5 years
24.70
38.50
Scale: |
High
Low
3.18
0.78
2.65
0.85
3.76
2.10
4.20
2.80
3.78
2.51
4.30
3.10
5.51
3.55
6.50
3.63
4.98
3.52
6.02
4.03
6.67
3.51
5.70
3.46
5.94
3.17
9.62
5.92
8.15
4.45
7.70
6.21
Currency:
2007
2008
2009
2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
Revenue per share
61.00
49.52
47.68
100.43
97.14
104.31
117.11
133.55
148.11
143.45
142.52
174.81
194.21
223.68
264.79
313.88
Earnings per share
7.34
3.78
3.75
9.76
7.19
7.04
8.21
11.57
10.46
11.15
11.20
12.35
8.02
12.65
27.94
29.05
FCF per share
6.30
6.32
2.26
1.40
0.71
(6.01)
6.31
3.05
14.00
12.98
10.99
4.29
6.48
5.57
4.09
18.29
Dividends per share
4.19
4.63
1.43
1.03
2.02
2.28
4.17
5.19
8.00
6.39
5.50
5.00
4.99
4.00
8.40
14.03
CAPEX per share
10.77
9.80
6.36
18.27
16.03
21.62
15.69
20.82
16.09
14.21
12.29
19.77
27.50
29.63
33.88
33.64
Book Value per sh.
45.33
36.53
39.81
47.12
53.02
58.89
64.78
76.76
80.89
80.82
92.31
94.87
93.74
101.35
117.82
140.96
Comm.Shares outs.
1,658
1,907
1,799
1,879
1,908
1,860
1,877
1,921
1,913
1,916
2,038
2,123
2,128
2,132
2,153
2,137
Avg. annual P/E ratio
0.4
0.6
0.5
0.3
0.5
0.5
0.4
0.4
0.5
0.4
0.4
0.4
0.5
0.4
0.3
0.2
P/E to S&P500
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
Avg. annual div. yield
141.9%
217.3%
79.5%
39.6%
59.0%
71.7%
118.9%
110.9%
159.6%
144.2%
110.3%
101.6%
113.2%
87.4%
106.9%
222.7%
Revenue (m)
101,168
94,431
85,775
188,743
185,347
193,972
219,862
256,591
283,303
274,884
290,441
371,092
413,182
476,979
569,997
670,873
Operating margin
19.1%
12.5%
10.5%
12.8%
9.1%
9.2%
9.4%
11.6%
8.7%
9.4%
8.7%
7.3%
5.6%
7.4%
11.1%
12.0%
Depreciation (m)
16,627
17,245
17,638
19,854
22,945
23,414
25,471
26,351
29,519
29,422
29,205
42,689
50,467
51,259
54,524
55,452
Net profit (m)
12,166
7,207
6,745
18,338
13,726
13,091
15,405
22,229
20,014
21,362
22,819
26,221
17,061
26,971
60,150
62,090
Income tax rate
19.3%
23.9%
17.7%
15.9%
17.8%
18.3%
18.1%
19.9%
17.0%
19.2%
21.0%
14.1%
21.5%
19.9%
22.4%
20.1%
Net profit margin
12.0%
7.6%
7.9%
9.7%
7.4%
6.7%
7.0%
8.7%
7.1%
7.8%
7.9%
7.1%
4.1%
5.7%
10.6%
9.3%
Working capital (m)
21,152
21,096
26,839
25,864
23,370
13,339
30,117
46,275
34,037
35,820
36,562
42,927
47,701
49,421
75,112
78,106
Long-term debt (m)
23,937
51,230
49,080
52,375
50,167
44,592
50,163
55,375
66,234
73,890
44,127
144,105
177,414
156,614
166,120
137,799
Equity (m)
75,177
69,672
71,616
88,556
101,170
109,515
121,616
147,482
154,714
154,878
188,120
201,388
199,427
216,115
253,627
301,285
ROIC
12.3%
6.9%
6.4%
13.5%
9.7%
9.3%
9.6%
11.4%
9.5%
9.8%
10.1%
8.2%
5.3%
7.6%
14.2%
14.0%
Return on capital
11.3%
7.5%
6.1%
11.4%
8.3%
7.4%
7.5%
9.3%
7.5%
8.4%
8.9%
6.6%
4.8%
6.6%
12.3%
11.9%
Return on equity
16.2%
10.3%
9.4%
20.7%
13.6%
12.0%
12.7%
15.1%
12.9%
13.8%
12.1%
13.0%
8.6%
12.5%
23.7%
20.6%
Plowback ratio
42.9%
(22.5)%
61.8%
89.4%
71.9%
67.6%
49.1%
55.2%
23.6%
42.7%
50.9%
59.5%
37.7%
68.4%
69.9%
63.3%
Div.&Repurch./FCF
56.7%
82.4%
95.6%
119.1%
487.6%
(37.9)%
37.5%
169.9%
77.0%
49.2%
4.1%
117.3%
77.0%
71.7%
268.2%
76.7%
Forex (TWD/USD)
0.031
0.030
0.031
0.034
0.033
0.034
0.034
0.032
0.030
0.031
0.034
0.033
0.033
0.036
0.036
0.034
Capital Structure
31 Dec · 2022 | Q4
All numbers in millions
Total liabilities
$ 387,143
Total assets
$ 707,068
Long-term debt
$ 137,799
Cash and equiv.
$ 58,040
Goodwill
$ - -
Retained earnings
$ - -
Common stock
2,086
Enterprise Value
$ 96,703
Working Capital
Currency: USD, in millions
2020
2021
2022
Cash & Investments
56,432
79,148
65,600
Receivables
101,014
135,344
114,647
Inventory
61,988
73,245
92,826
Other
4,579
29,156
33,796
Current assets
224,013
292,358
300,367
Acc. Payable
73,268
84,470
- -
Debt due
41,315
49,558
56,772
Other
60,009
83,217
165,489
Current liabilities
174,592
217,245
222,261
Annual growth rates
(avg. rate of change)
1 year
5 years
10 years
Revenue
17.70%
16.00%
13.51%
Cash flow
344.14%
88.94%
65.03%
Earnings
3.22%
37.35%
23.58%
Dividends
65.86%
39.59%
22.82%
Book value
18.79%
10.89%
10.93%
Quarterly Revenue
Currency: USD, in millions
Year
1Q
2Q
3Q
4Q
Total
2020
97,357
107,549
123,195
148,877
476,978
2021
119,470
126,926
150,665
172,936
569,997
2022
144,391
160,439
188,626
177,417
670,873
Earnings per share
Currency: USD
Year
1Q
2Q
3Q
4Q
Total
2020
1.83
3.25
3.15
4.71
12.94
2021
3.98
4.80
6.59
14.36
29.73
2022
6.04
7.48
8.17
7.36
29.05
Quarterly dividends paid
Currency: USD
Year
1Q
2Q
3Q
4Q
Total
2020
- -
- -
4.00
- -
4.00
2021
- -
- -
8.40
- -
8.40
2022
- -
- -
14.03
- -
14.03
Company Description
Sector:
Technology
Industry:
Semiconductors
CEO:
Mr. Hung-Pen Chang
Full-time employees:
99,104
City:
Kaohsiung
Address:
26, Chin 3rd Road
ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various packages; and copper and silver wire bonding solutions. The company also provides advanced packages, such as flip chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer-level packaging; SESUB; and 2.5D silicon interposer. In addition, it offers IC wire bonding packages; system-in-package products (SiP) and modules; and interconnect materials, as well as assembles automotive electronic products. Further, the company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/MEMS/discrete final testing, and other test-related services, as well as drop shipment services. Additionally, it develops, constructs, sells, leases, and manages real estate properties; produces substrates; offers information software, equipment leasing, investment advisory, and warehousing management services; processes and sells computer and communication peripherals, electronic components, telecommunications equipment, and motherboards; and imports and exports goods and technology. The company was incorporated in 1984 and is headquartered in Kaohsiung, Taiwan.