ASE Technology Holding Co., Ltd.
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- ASE Technology Holding Co., Ltd. (NYSE: ASX; TWSE: 3711) operates as the world's largest provider of outsourced semiconductor assembly and testing services, along with electronic manufacturing services. The company offers advanced packaging solutions including flip-chip, wire bonding, wafer-level packaging (WLP), fan-out wafer-level packaging (FO-WLP), system-in-package (SiP), 2.5D and 3D packaging, bumping, and copper wire bonding; comprehensive testing services encompassing front-end engineering testing, wafer probing, final testing, functional, parametric, and reliability testing; and electronic manufacturing services (EMS) such as PCB assembly, system assembly, box build, design services, logistics, and repair for electronic components and telecommunication equipment motherboards. It serves fabless semiconductor companies, integrated device manufacturers, foundries, and original equipment/design manufacturers across communications, computing, consumer, automotive, industrial, healthcare, AI, high-performance computing (HPC), 5G, and other sectors. ASE Technology Holding maintains an extensive global manufacturing footprint with over 100,000 employees and facilities in Taiwan, China, South Korea, Japan, Singapore, Malaysia, Vietnam, Mexico, the United States, Poland, France, the United Kingdom, Germany, Tunisia, and Czech Republic; more than half of its sales derive from U.S. customers. Headquartered in Kaohsiung, Taiwan, the company traces its origins to Advanced Semiconductor Engineering, founded in 1984, and established its current holding structure in 2018 through the combination of ASE, Siliconware Precision Industries (SPIL), and Universal Scientific Industrial (USI). Recent developments include a strategic collaboration with Analog Devices, Inc., announced in October 2025, under which ASE plans to acquire ADI's manufacturing facility in Penang, Malaysia, enter a long-term supply agreement for IC packaging and testing services, and co-invest in facility enhancements to bolster global supply chain resilience and advanced manufacturing capabilities. In 2025, ASE committed $2.5 billion in capital expenditures, a 32% increase from the prior year, to expand advanced packaging capacity, including U.S. investments responsive to potential tariffs and support for AI initiatives like Nvidia's projects. The company broke ground earlier in 2025 on a $579 million plant in Kaohsiung for chip-on-wafer-on-substrate (CoWoS) packaging services, expected to create 2,000 jobs and complete by early 2028, alongside launching its fifth facility in Penang, Malaysia, to advance packaging and testing for next-generation applications.
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