US stock · Technology sector · Semiconductors
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Amkor Technology, Inc.

AMKRNASDAQ

22.57

USD
+0.10
(+0.45%)
Market Closed
8.00P/E
7Forward P/E
0.38P/E to S&P500
5.526BMarket CAP
0.85%Div Yield
Upcoming Earnings
24 Oct-28 Oct
Shares Short
7/29/22
4.48M
Short % of Float
7.88%
Short % of Shares Outs.
1.83%
% Held by Insiders
85.16%
% Held by Institutions
40.19%
Beta
1.56
PEG Ratio
0.71
52w. high/low
29.50/14.89
Avg. Daily Volume
0.84M
Return %
Stock
S&P 500
1 year
(9.36)
(3.04)
3 years
156.77
49.53
5 years
163.36
75.90
Scale: |
High
Low
16.29
7.60
12.70
1.33
7.70
1.60
8.81
5.05
8.49
3.81
6.78
3.65
6.19
3.55
12.27
5.02
10.13
4.01
12.48
4.09
12.48
8.32
11.68
5.72
15.25
6.29
15.80
5.40
29.50
14.82
26.64
14.89
Currency: USD
2006
2007
2008
2009
2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
TTM
Revenue per share
15.36
15.17
14.55
11.90
16.04
14.55
17.24
15.81
13.56
12.18
16.40
17.52
18.04
16.91
20.91
25.42
26.63
Earnings per share
0.96
1.22
(2.50)
0.85
1.27
0.48
0.26
0.58
0.57
0.24
0.69
1.09
0.53
0.50
1.40
2.66
2.84
FCF per share
1.17
2.03
1.20
0.24
0.53
0.26
(0.90)
(0.05)
(0.29)
0.17
0.33
0.28
0.49
0.38
0.90
1.41
3.82
Dividends per share
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
0.21
0.19
CAPEX per share
1.78
1.31
2.11
1.19
2.43
2.45
3.33
3.03
2.95
2.27
2.74
2.31
2.29
1.97
2.29
3.23
0.79
Book Value per sh.
2.22
3.62
1.30
2.09
3.44
3.63
4.11
5.10
4.84
5.10
5.83
6.98
7.65
8.19
9.63
12.18
12.24
Comm.Shares outs.
178
181
183
183
183
191
160
187
231
237
237
239
239
240
242
242
244
Avg. annual P/E ratio
8.4
9.7
(3.2)
5.5
5.2
12.2
19.2
7.9
14.0
27.2
10.7
9.7
16.3
18.7
8.5
8.5
8.0
P/E to S&P500
0.5
0.6
(0.1)
0.1
0.2
0.7
1.3
0.5
0.8
1.4
0.5
0.4
0.7
0.8
0.2
0.3
0.4
Avg. annual div. yield
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
0.9%
0.9%
Revenue (m)
2,729
2,739
2,659
2,179
2,939
2,776
2,760
2,956
3,129
2,885
3,894
4,186
4,316
4,053
5,051
6,138
6,507
Operating margin
14.1%
14.3%
(15.3)%
10.3%
12.7%
7.0%
5.5%
7.9%
7.1%
5.7%
7.5%
7.0%
6.0%
5.8%
9.1%
12.4%
12.5%
Depreciation (m)
286
289
310
306
324
336
370
410
465
494
555
582
572
524
510
564
588
Net profit (m)
170
220
(457)
156
232
92
42
109
130
57
164
261
127
121
338
643
693
Income tax rate
6.1%
5.4%
(7.5)%
(23.5)%
7.6%
7.1%
28.5%
18.3%
24.9%
41.5%
22.2%
12.8%
30.3%
23.3%
11.9%
9.7%
10.4%
Net profit margin
6.2%
8.0%
(17.2)%
7.2%
7.9%
3.3%
1.5%
3.7%
4.2%
2.0%
4.2%
6.2%
2.9%
3.0%
6.7%
10.5%
10.6%
Working capital (m)
215
310
306
327
290
355
439
541
497
299
404
289
513
942
817
1,177
1,179
Long-term debt (m)
1,820
1,612
1,439
1,345
1,214
1,287
1,545
1,591
1,526
1,519
1,440
1,241
1,218
1,306
1,090
1,069
1,057
Equity (m)
394
655
237
383
630
693
658
954
1,116
1,208
1,384
1,667
1,831
1,964
2,326
2,942
3,196
ROIC
7.0%
8.8%
(18.2)%
16.4%
16.6%
8.1%
4.7%
7.1%
7.1%
3.3%
7.5%
10.7%
5.5%
4.9%
10.7%
15.9%
16.1%
Return on capital
6.0%
7.3%
(13.0)%
10.0%
12.9%
6.7%
5.2%
7.0%
7.6%
4.3%
7.3%
8.6%
5.9%
4.9%
9.0%
12.7%
13.0%
Return on equity
43.2%
33.6%
(192.6)%
40.7%
36.8%
13.2%
6.4%
11.5%
11.7%
4.7%
11.9%
15.6%
6.9%
6.2%
14.5%
21.9%
21.7%
Plowback ratio
100.0%
100.0%
100.0%
100.0%
100.0%
100.0%
100.0%
100.0%
100.0%
100.0%
100.0%
100.0%
100.0%
100.0%
100.0%
92.0%
93.3%
Div.&Repurch./FCF
(2.4)%
(10.1)%
- -
(1.6)%
(1.1)%
254.4%
(55.9)%
5.1%
9.3%
(2.3)%
(10.4)%
(4.6)%
(0.9)%
(12.5)%
(8.1)%
15.0%
5.0%
Capital Structure
4 Aug · 2022 | Q2
All numbers in millions
Total liabilities
$ 3,194
Total assets
$ 6,391
Long-term debt
$ 1,057
Cash and equiv.
$ 734
Goodwill
$ 21
Retained earnings
$ 1,435
Common stock
245
Enterprise Value
$ 5,849
Working Capital
Currency: USD, in millions
2019
2020
2021
Cash & Investments
895
832
1,078
Receivables
851
963
1,259
Inventory
221
297
485
Other
35
(156)
(34)
Current assets
2,002
2,133
2,857
Acc. Payable
571
636
829
Debt due
195
211
248
Other
294
468
603
Current liabilities
1,060
1,316
1,680
Annual growth rates
(avg. rate of change)
1 year
5 years
10 years
Revenue
21.54%
10.79%
10.09%
Cash flow
57.37%
61.53%
82.98%
Earnings
90.16%
53.43%
65.08%
Dividends
- -
- -
- -
Book value
26.51%
15.50%
18.59%
Insider Trading
Type
Shares
Date
Rutten Guillaume Marie Jean
Exempt
20,000
08/02/22
Rutten Guillaume Marie Jean
Exempt
10,000
08/02/22
Rutten Guillaume Marie Jean
Sale
60,000
08/02/22
Rutten Guillaume Marie Jean
Exempt
20,000
08/02/22
Rutten Guillaume Marie Jean
Exempt
10,000
08/02/22
Quarterly Revenue
Currency: USD, in millions
Year
1Q
2Q
3Q
4Q
Total
2020
1,153
1,173
1,354
1,371
5,051
2021
1,326
1,407
1,681
1,725
6,138
2022
1,597
1,505
- -
- -
- -
Earnings per share
Currency: USD
Year
1Q
2Q
3Q
4Q
Total
2020
0.26
0.23
0.38
0.52
1.40
2021
0.50
0.52
0.75
0.90
2.66
2022
0.70
0.51
- -
- -
- -
Quarterly dividends paid
Currency: USD
Year
1Q
2Q
3Q
4Q
Total
2020
- -
- -
- -
- -
- -
2021
0.08
0.04
0.04
0.05
0.21
2022
0.05
0.05
- -
- -
- -
Company Description
Sector:
Technology
Industry:
Semiconductors
CEO:
Mr. Stephen Kelley
Full-time employees:
30,400
City:
Tempe
Address:
2045 East Innovation Circle
IPO:
May 1, 1998
Website:
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the rest of the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, and test and drop shipment services. The company also provides flip chip-scale package products for use in smartphones, tablets, and other mobile consumer electronic devices; flip-chip stacked chip-scale packages that are used to stack memory on top of digital baseband, and as applications processors in mobile devices; and flip-chip ball grid array packages for various networking, storage, computing, and consumer applications. In addition, it offers wafer-level CSP packages that are used in power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages for use in ICs; and silicon wafer integrated fan-out technology, which replaces a laminate substrate with a thinner structure. Further, the company provides lead frame packages that are used in electronic devices for low to medium pin count analog and mixed-signal applications; substrate-based wirebond packages, which are used to connect a die to a substrate; micro-electro-mechanical systems (MEMS) packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules, which are used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. It primarily serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.