Alpha and Omega Semiconductor Limited
NASDAQ Global SelectCapital Structure
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in mil. unless spec.Working Capital
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in mil. unless spec.Growth Rates
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in mil. unless spec.Quarterly Revenue
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Quarterly Dividends Per Share
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in mil. unless spec.- CEO
- Stephen Chunping Chang
- Full Time Employees
- 2,332
- Sector
- Technology
- Industry
- Semiconductors
- Address
- 475 Oakmead Parkway Sunnyvale CA United States of America 94085
- IPO Date
- Apr 29, 2010
- CIK
- 0001387467
- Website
- aosmd.com
- Similar Companies
- Business
- Alpha and Omega Semiconductor Limited Alpha and Omega Semiconductor Limited designs, develops, and globally supplies a broad portfolio of power semiconductors for high-volume applications in computing, consumer electronics, communications, industrial, automotive, and enterprise sectors including personal computers, graphics cards, data centers, AI servers, smartphones, flat-panel TVs, LED lighting, battery packs, motor controls, power supplies, servers, and telecommunications equipment. The company offers power discrete products such as low-, medium-, and high-voltage power MOSFETs, insulated-gate bipolar transistors (IGBTs), silicon carbide (SiC) devices based on its AlphaSiC platform, transient voltage suppressors (TVS), and modules; as well as power integrated circuits (ICs) encompassing DC-DC converters, LED drivers, AC-DC controllers, high-voltage gate drivers, intelligent power modules (IPMs), and digital power products that optimize power management, efficiency, voltage regulation, current control, and protection against electrostatic discharge and transients. Founded in 2000 and headquartered in Sunnyvale, California, with operations including wafer fabrication through its wholly owned subsidiary Jireh Semiconductor in Hillsboro, Oregon, and manufacturing facilities and joint ventures in China, Hong Kong, South Korea, and the United States, Alpha and Omega Semiconductor employs a fab-lite strategy blending in-house production and outsourcing to ensure flexibility and cost optimization. In July 2025, the company agreed to sell approximately 20.3% of its equity stake in its Chongqing, China joint venture—representing power semiconductor packaging, testing, and 12-inch wafer fabrication—for $150 million in cash to be received in installments by year-end, enabling reinvestment in technology, R&D, complementary asset acquisitions, and intellectual property while retaining manufacturing access and IP protections under existing agreements; additionally, it launched a new 25V MOSFET for high-power density applications now in production, settled U.S. export control allegations for $4.25 million without operational impact, and reported growth in computing and power supply segments despite market challenges.
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