CEVA, Inc.
NASDAQ Global SelectCapital Structure
•
in mil. unless spec.Working Capital
•
in mil. unless spec.Growth Rates
•
in mil. unless spec.Quarterly Revenue
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Quarterly Dividends Per Share
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in mil. unless spec.- CEO
- Amir Panush
- Full Time Employees
- 400
- Sector
- Technology
- Industry
- Semiconductors
- Address
- 15245 Shady Grove Road Rockville MD United States of America 20850
- IPO Date
- Nov 1, 2002
- CIK
- 0001173489
- Website
- ceva-ip.com
- Similar Companies
- Business
- CEVA, Inc. (Nasdaq: CEVA) develops and licenses silicon intellectual property (IP) and embedded software solutions that enable semiconductor and electronics companies to create smart edge products capable of connecting, sensing, and inferring data; its core offerings encompass DSP cores including AI DSPs and neural processing units (NPUs) such as the NeuPro family, wireless connectivity IP for Wi-Fi (including 802.11ax and Wi-Fi 7), Bluetooth (low energy, dual mode, and high data throughput), cellular IoT (LTE-advanced, 5G NR, NB-IoT), and V2X communications, signal processing platforms for audio (including ANC and spatial audio), voice processing, imaging and computer vision, sensor fusion, and embedded vision, as well as software solutions for edge AI, always-on processing, and sensor fusion applications targeting consumer IoT, mobile devices, PCs, automotive (ADAS), industrial, surveillance, robotics, smart home, wearables, and infrastructure markets worldwide. Founded in 1999 and headquartered in Rockville, Maryland, with design centers in Israel, the United States, France, Ireland, and other locations across Europe and Asia, CEVA powers more than 20 billion devices globally and maintains over 400 employees focused on ultra-low power, high-performance technology. Recent developments include a long-term partnership with Microchip Technology announced in November 2025 to embed CEVA's NeuPro NPU family in Microchip's microcontroller and connectivity platforms, the commencement of a $58.5 million underwritten public offering of common stock in late November 2025 to fund potential acquisitions, investments in complementary technologies, working capital, and general corporate purposes, alongside Q3 2025 financial results showing total revenue of $28.4 million (up from $27.2 million year-over-year) driven by record wireless IoT shipments, AI processor licensing contributing one-third of licensing revenue, and 12 new IP agreements including AI DSPs for automotive ADAS and home appliances, communications DSPs for satellite and V2X, and connectivity wins for consumer and industrial devices.
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