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ChipMOS TECHNOLOGIES INC.

IMOS US

IMOS USChipMOS TECHNOLOGIES INC.

United States Composite

28.50

USD

+0.65

(+2.33%)

82.68EPS Dil.

0.34P/E

1.04BMarket Cap

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Ex-Dividend Date

June 29

Dividend Date

July 27

Held by Insiders

- -

Held by Institutions

7.60%

Short % of Float

0.19%

YTD Yield

16.46%

3Y Yield

-18.12%

5Y Yield

60.60%

Capital Structure

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Jun'22

Jun'23

Dec'23

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LT Borrowings

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LT Finance Leases

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Preferred Equity and Hybrid Capital

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Market Capitalization

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Working Capital

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Jun'22

Jun'23

Dec'23

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Cash, Cash Equivalents & STI

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Accounts Receivable, Net

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Total Current Liabilities

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Payables & Accruals

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Deferred Revenue

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Growth Rates

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(avg. rate of change)

10 years

5 years

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Total Equity

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Quarterly Revenue

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Year

2021

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2022

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2023

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Quarterly Earnings Per Share

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Year

2021

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2022

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2023

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Quarterly Dividends Per Share

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Year

2021

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2022

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2023

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Company Description

CEO: Mr. Shih-Jye Cheng
Sector: Technology
Industry: Semiconductors
Address: No. 1, R&D Road 1 Hsinchu City Taiwan 300-092
IPO Date: Jul 3, 2003
Website: www.chipmos.com
Business: ChipMOS TECHNOLOGIES INC. researches, develops, manufactures, and sells high-integration and high-precision integrated circuits, and related assembly and testing services in the People's Republic of China, Japan, Singapore, and internationally. It operates through Testing; Assembly; Testing and Assembly for LCD, OLED and Other Display Panel Driver Semiconductors; Bumping; and Others segments. The company provides a range of back-end assembly and testing services, including engineering test, wafer probing, and final test of memory and logic/mixed-signal semiconductors, as well as leadframe-based and organic substrate-based package assembly services for memory and logic/mixed-signal semiconductors; and gold bumping, reel to reel assembly, and test services for LCD, OLED, and other panel display driver semiconductors. Its semiconductors are used in personal computers; graphics applications, such as game consoles; communications equipment; mobile products comprising cellular handsets, tablets, and consumer electronic products; and automotive/industry and display applications, such as display panels. ChipMOS TECHNOLOGIES INC. was incorporated in 1997 and is headquartered in Hsinchu, Taiwan.

Company News

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3 days ago
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2 months ago
ChipMOS to Present at BofA Securities 2024 APAC TMT CONFERENCE
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2 months ago
ChipMOS REPORTS 23.6% INCREASE IN FEBRUARY 2024 REVENUE YEAR OVER YEAR

Company Description

CEO: Mr. Shih-Jye Cheng
Sector: Technology
Industry: Semiconductors
Address: No. 1, R&D Road 1 Hsinchu City Taiwan 300-092
IPO Date: Jul 3, 2003
Website: www.chipmos.com
Business: ChipMOS TECHNOLOGIES INC. researches, develops, manufactures, and sells high-integration and high-precision integrated circuits, and related assembly and testing services in the People's Republic of China, Japan, Singapore, and internationally. It operates through Testing; Assembly; Testing and Assembly for LCD, OLED and Other Display Panel Driver Semiconductors; Bumping; and Others segments. The company provides a range of back-end assembly and testing services, including engineering test, wafer probing, and final test of memory and logic/mixed-signal semiconductors, as well as leadframe-based and organic substrate-based package assembly services for memory and logic/mixed-signal semiconductors; and gold bumping, reel to reel assembly, and test services for LCD, OLED, and other panel display driver semiconductors. Its semiconductors are used in personal computers; graphics applications, such as game consoles; communications equipment; mobile products comprising cellular handsets, tablets, and consumer electronic products; and automotive/industry and display applications, such as display panels. ChipMOS TECHNOLOGIES INC. was incorporated in 1997 and is headquartered in Hsinchu, Taiwan.