Veeco Instruments Inc.
NASDAQ Global SelectCapital Structure
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in mil. unless spec.Working Capital
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in mil. unless spec.Growth Rates
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in mil. unless spec.Quarterly Revenue
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Quarterly Dividends Per Share
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in mil. unless spec.- CEO
- William John Miller
- Full Time Employees
- 1,231
- Sector
- Technology
- Industry
- Semiconductors
- Address
- 1 Terminal Drive Plainview NY United States of America 11803
- IPO Date
- Nov 29, 1994
- CIK
- 0000103145
- Website
- veeco.com
- Similar Companies
- Business
- Veeco Instruments Inc. designs, manufactures and markets thin-film process equipment for high-volume production and development of advanced electronic devices, including semiconductors, compound semiconductors, hard disk drives and microelectromechanical systems (MEMS). The company offers laser annealing and processing systems; lithography systems for advanced packaging, LEDs and power devices; ion beam deposition, etch and sputtering systems; silicon carbide (SiC) chemical vapor deposition (CVD) systems such as the EpiStride platform; metal organic chemical vapor deposition (MOCVD) systems for GaN and As/P applications in displays, 3D sensing and optical communications; molecular beam epitaxy (MBE) systems; wet processing systems including WaferStorm and WaferEtch for single-wafer etch and clean; atomic layer deposition (ALD) systems; physical vapor deposition (PVD) systems on the NEXUS platform; and gas and vapor delivery systems, dicing and lapping tools. Founded in 1945 and headquartered in Plainview, New York, Veeco operates globally across the United States, Europe, the Middle East, Africa, China and the rest of Asia-Pacific, serving markets such as 5G/6G, AI, data storage, electric vehicles, photonics and advanced packaging. In October 2025, Veeco agreed to merge with Axcelis Technologies Inc. in a $5.2 billion all-stock transaction expected to close in the second half of 2026, creating a leading U.S. semiconductor equipment supplier with combined fiscal 2024 revenue of $1.7 billion, enhanced R&D capabilities and projected $35 million in annual synergies; the deal diversifies its portfolio with ion implantation and laser anneal technologies while initiating a share buyback program. Recent developments include over $50 million in wet processing system orders for AI advanced packaging in 2025, an agreement with IBM to explore wet processing for advanced packaging applications, multiple lithography and wet processing orders for silicon photonics, and the 2024 acquisition of the NXG XII 600 additive manufacturing system from Nikon SLM Solutions.
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